In interviews while onboard, Butch and Suni have said they were well prepared for their longer than expected stay - but there were things they were looking forward to when they got home.
Read our full Fujifilm Instax Mini Evo review.
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EMIB-T,即“EMIB with TSV(Through-Silicon Via)”,是在英特尔原有EMIB(嵌入式多芯片互连桥)技术基础上的一次关键升级。传统EMIB利用嵌入在封装基板中的硅桥,实现多颗裸晶之间的高速互连。